INTEL DH61AGL DESKTOP BOARD DRIVER DETAILS:
|File Size:||3.5 MB|
|Supported systems:||Windows Vista, Windows Vista 64-bit, Windows XP 64-bit, Mac OS X, Mac OS X 10.4, Mac OS X 10.5|
|Price:||Free* (*Free Registration Required)|
INTEL DH61AGL DESKTOP BOARD DRIVER
▷ **B Grade** Intel DH61AG Intel H61 (Socket 11… OcUK
The following notations are used in the table: Document change or update that will be implemented. This erratum may be fixed in a future revision of the desktop board, driver, or BIOS. This erratum has been previously fixed. There are no plans to fix this erratum. This erratum is either new or modified from the previous version of the document. Changes were made to the Thermal Considerations for Components table, as well Intel DH61AGL Desktop Board lead-in text and a new table, Tcontrol Values for Components in Section 2.
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For a Intel DH61AGL Desktop Board of chassis that have been tested with Intel desktop boards please refer to the following website: All responsibility for determining the adequacy of any thermal or system design remains solely with the reader. Intel makes no warranties or representations that merely following the instructions presented in this document will result in a system with adequate thermal performance. Failure to do so could cause components to exceed their maximum case temperature and malfunction. For information about the maximum operating temperature, see the environmental specifications in Section 2.
Failure to do so may result in damage to the voltage regulator circuit. The processor voltage regulator area shown in Figure 15 can reach a temperature of up to 95 o C in an open chassis. The operating temperature, current load, or operating frequency could affect case temperatures. Maximum case temperatures are important when considering proper airflow to cool the board. This is a requirement for sustained power dissipation equal to Thermal Design Power TDP is specified as the maximum sustainable power to be dissipated by the components. The surface temperature at the geometric center of the component corresponds to Case Temperature. It is important to note that the temperature measurement Intel DH61AGL Desktop Board the system BIOS is a value reported by embedded thermal sensors in the components and does not directly correspond to the Maximum Case Temperature.
The upper operating limit when monitoring this thermal sensor is Tcontrol.
The following is a correction to Item 2 above in the Document Changes section of this document. Localized High Temperature Zones Table Support for up to 8 GB system memory has been changed to support for up to 16 GB system memory. Partial section of Table 1 shown Intel DH61AGL Desktop Board. Double-sided DIMMs with x16 organization are not supported. Minimum recommended total system memory: If non-spd memory is installed, the BIOS will attempt to correctly configure the memory settings, but performance and reliability may be impacted or the DIMMs may not function under the determined frequency.
Max of Memory Channels The number of memory channels refers to the bandwidth operation for real world application. Graphics Output Graphics Output defines the interfaces available to communicate with display devices.
PCIe x1 Gen 2. PCIe x4 Gen 2. PCIe x8 Gen 2.
PCIe x16 Gen 2. PCIe x1 Gen 1. PCIe x4 Gen 1. PCIe x8 Gen 1.
YTAI for Intel DH61AG desktop motherboard LGA1155 H61 DDR3 USB3.0 mainboard 100% tested
PCIe x16 Gen 1. Whether using one or multiple hard drives, users can take advantage of enhanced performance and lower power consumption. When using more than one drive the user can have additional protection against data loss in the event of hard drive failure. Intel® Desktop Board DH61AGL quick reference guide including specifications, features, pricing, compatibility, design documentation, ordering codes, spec.
Intel Desktop Board DH61AGL Motherboard Thin Mini ITX - Lga Socket H61 eBay
Intel® Desktop Board DH61AGL. Support information for Intel® Desktop Board DH61AGL. This product is discontinued.
See available support options.